Jianping Zeng
Ph.D.
Lawson Hall 3133-6, 305 N. University Street West Lafayette, IN 47907
Department of Computer Science
Purdue University
Email: zeng207 (at) purdue (dot) edu
Biography
I got my Ph.D. degree in Computer Science from Purdue University where I was fortunately advised by Prof. Changhee Jung. In the meanwhile, I also closely work with Prof. Dongyoon Lee at Stony Brook University, Prof. Trevor E. Carlson at National University of Singapore, and Prof. Jongouk Choi at University of Central Florida. Prior to joining Purdue University, I worked as a compiler engineer with focuses on optimizing the middle-end and backend of GCC (GNU Compiler Collection) for CSKY architecture (an embedded architecture widely used in network switch, printer, etc) of Alibaba T-Head Semiconductor. I obtained my Master degree from School of Computer Science of Huazhong University of Science and Technology (HUST), China.
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Research
My research interests generally lie in designing more reliable and performant
computing systems, including server-class systems and energy-harvesting systems,
against soft errors and power failures. To achieve this, I usually co-design
compilers and architectures to maintain minimal hardware complexity while
achieving high performance. My research works are typically published at top-tier
system venues, e.g., PLDI, MICRO, HPDC, ISCA, RTSS, and ICS.
5 first-author publications in top computer architecture/HPC conferences: (1) MICRO'21 x2, (2) MICRO'23, (3) ISCA'24, (4) ICS'24.
6 second-author publications in top computer system conferences: (1) PLDI'20, (2) HPDC'22, (3) ISCA'23, (4) MICROx2, (5) RTSS'23.
News
Conference Paper
[TOP-TIER]
tag is used to mark the paper that
appears in one of the top CS conferences selected by csrankings.org.
[TOP-TIER]
LightWSP: Whole-System Persistence on the Cheap [PDF]Yuchen Zhou, Jianping Zeng, Changhee Jung
57th International IEEE/ACM Symposium on Microarchitecture (MICRO-2024), Austin, Texas, November 2024.
Acceptance rate: 22.7% (113 out of 497 submissions)
[TOP-TIER]
Compiler-Directed Whole-System Persistence [PDF]
[PPT]Jianping Zeng, Tong Zhang, Changhee Jung
51th International ACM/IEEE Symposium on Computer Architecture (ISCA-2024), Buenos Aires, Argentina, June 2024.
Acceptance rate: 19.6% (83 out of 423 submissions)
[TOP-TIER]
Soft Error Resilience at Near-Zero Cost [PDF]
[PPT]Jianping Zeng, Shao-Yu Huang, Jiuyang Liu, Changhee Jung
38th ACM International Conference on Supercomputing (ICS 2024), Kyoto, Japan, June 2024.
[TOP-TIER]
RTailor: Parameterizing Soft Error Resilience for Mixed-Criticality Real-Time Systems
[PDF]Shao-Yu Huang, Jianping Zeng, Xuanliang Deng, Sen Wang, Ashrarul Haq Sifat, Burhanuddin Bharmal, Jia-Bin Huang, Ryan Williams, Haibo Zeng and Changhee Jung
44th International IEEE Real-Time Systems Symposium, Taipei, December 2023.
[TOP-TIER]
Persistent Processor Architecture [PDF]
[PPT]Jianping Zeng, Jungi Jeong, Changhee Jung
56th International IEEE/ACM Symposium on Microarchitecture (MICRO-2023), Toronto, Canada, October 2023.
Acceptance rate: 23.8% (101 out of 404 submissions)
Nominated as Memorable Paper Finalist in NVMW'24
[TOP-TIER]
SweepCache: Intermittence-Aware Cache on the Cheap [PDF]
[PPT]Yuchen Zhou, Jianping Zeng, Jungi Jeong, Jongouk Choi, Changhee Jung
56th International IEEE/ACM Symposium on Microarchitecture (MICRO-2023), Toronto, Canada, October 2023.
Acceptance rate: 23.8% (101 out of 404 submissions)
[TOP-TIER]
Write-Light Cache for Energy Harvesting Systems [PDF]Jongouk Choi, Jianping Zeng, Dongyoon Lee, Changwoo Min, Changhee Jung
50th International ACM/IEEE Symposium on Computer Architecture (ISCA-2023), Orlando, USA, June 2023.
Acceptance rate: 21% (79 out of 373 submissions)
[TOP-TIER]
Capri: Compiler and Architecture Support for Whole-System Persistence [PDF]
[PPT]Jungi Jeong, Jianping Zeng, Changhee Jung
31th International ACM Symposium on High-Performance Parallel and Distributed Computing (HPDC-2022), Minneapolis, USA, June 2022.
Acceptance rate: 19% (21 out of 108 submissions)
[TOP-TIER]
ReplayCache: Enabling Volatile Caches for Energy Harvesting Systems [PDF]
[PPT]Jianping Zeng, Jongouk Choi, Xinwei Fu, Ajay P. Shreepathi, Dongyoon Lee, Changwoo Min, and Changhee Jung
54th IEEE/ACM International Symposium on Microarchitecture (MICRO-2021), Online, October 2021.
Acceptance rate: 21.8% (94 out of 430 submissions)
[TOP-TIER]
Turnpike: Lightweight Soft Error Resilience for In-Order Cores [PDF]
[PPT]Jianping Zeng, Hongjune Kim, Jaejin Lee, and Changhee Jung
54th IEEE/ACM International Symposium on Microarchitecture (MICRO-2021), Online, October 2021.
Acceptance rate: 21.8% (94 out of 430 submissions)
[TOP-TIER]
Compiler-Directed Soft Error Resilience for Lightweight GPU Register File Protection [PDF]Hongjune Kim, Jianping Zeng, Qingrui Liu, Mohammad Abdel-Majeed, Jaejin Lee, and Changhee Jung
41th ACM SIGPLAN Conference on Programming Language Design and Implementation (PLDI-2020), Online, June 2020.
Acceptance rate: 22.5% (77 out of 341 submissions)
Workshop Paper
Jianping Zeng, Jungi Jeong, Changhee Jung
15th Non-Volatile Memories Workshop (NVMW), San Diego, USA, March 2024.
Yuchen Zhou, Jianping Zeng, Jungi Jeong, Jongouk Choi, Changhee Jung
15th Non-Volatile Memories Workshop (NVMW), San Diego, USA, March 2024.
Jongouk Choi, Jianping Zeng, Dongyoon Lee, Changwoo Min, Changhee Jung
15th Non-Volatile Memories Workshop (NVMW), San Diego, USA, March 2024.
Jungi Jeong, Jianping Zeng, Changhee Jung
14th Non-Volatile Memories Workshop (NVMW), San Diego, USA, March 2023.
Jianping Zeng, Jongouk Choi, Xinwei Fu, Ajay P. Shreepathi, Dongyoon Lee, Changwoo Min, and Changhee Jung
13th Non-Volatile Memories Workshop (NVMW), San Diego, USA, May 2022.
Teaching Experience
Mentees
Honor
Working Experience
Service
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Languages, Compilers, Tools and Theory of Embedded Systems (LCTES): 2020 (Web Chair).
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IEEE Computer Architecture Letter (CAL): 2022.
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ACM Transactions on Architecture and Code Optimization (TACO): 2023, 2024.
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IEEE Transactions on Computers (TOC): 2024.
- Architectural Support for Programming Languages and Operating Systems (ASPLOS): 2020, 2022-2023.
- USENIX Annual Technical Conference (ATC): 2020.
- International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES): 2020, 2023, 2024.
- International Conference on Compiler Construction (CC): 2020.
- International Symposium on Computer Architecture (ISCA): 2023, 2024.
- Principles and Practice of Parallel Programming (PPoPP): 2020-2023.
- International Symposium on Microarchitecture (MICRO): 2020, 2022, 2024.
- International Symposium on High-Performance Parallel and Distributed Computing (HPDC): 2020, 2022, 2024.
- International Symposium on Code Generation and Optimization (CGO): 2020, 2022.
Software Package
BarGraphGenerator: an easy-to-use bar graph generator. I have developed a bar graph generator written in Python 3 by leveraging Matplotlib. With input plain text file provided, it generates various bar graphs, e.g., simple bar graph, cluster graph, stacked graph, and stacked cluster graph with option specified in the input file. Please see the example files under the examples directory. All of these bar graphs in my published papers are plotted by this tool! This project was inspired by Derek Bruening's bargraph tool. However, this tool is dependent on GNU libraries which have some compatible issues with MacOS and modern Linux distributions. More importantly, his tool is written in perl which is not friendly to use and maintain in my end. I try to response to these inquiries about how to use my tool in a best effort manner but can not promise that. Obviously, bug fix and patching requrests are welcome!For Fun
When I was a graduate student at HUST, I have been developing a research compiler, XCC written in Java for fun and learning purpose. This compiler accepts the LLVM-3 compatible bitcode as an input and generates assembly code for x86 and ARMv7 ISA. XCC can work together with dragonegg-3.0 and LLVM 3.0 to generate binaries for SPEC CPU2006 programs. Notably, LLVM 3.0 just provides some interfaces to dragonegg for translating C/C++ source code into LLVM IR which is fed back to XCC to generate assembly code.